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GY-521 MPU-6050 Module 3 Axis Accelerometer Analog Gyro Sensors 6DOF Module DIY Kit Board
Specifications:
PCB Process for Gold Deposition.
Using chips: MPU6050 + HMC5883L + BMP180
Power supply: 3-5v
Communication mode: IIC communication protocol (fully compatible with 3-5v system, including LLC circuit)
Dimension: 22mm*17mm*3mm/0.86*0.66*0.11''
Packing weight: 3g
Note:
Please allow 1-3mm differs due to manual measurement.
Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understanding.
Included:
1 x MPU-6050 Module
Specifications:
PCB Process for Gold Deposition.
Using chips: MPU6050 + HMC5883L + BMP180
Power supply: 3-5v
Communication mode: IIC communication protocol (fully compatible with 3-5v system, including LLC circuit)
Dimension: 22mm*17mm*3mm/0.86*0.66*0.11''
Packing weight: 3g
Note:
Please allow 1-3mm differs due to manual measurement.
Due to the different display and different light, the picture may not show the actual color of the item. Thanks for your understanding.
Included:
1 x MPU-6050 Module
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